Product Info

Lead co-deposition as an alternative of Tin Whisker mitigation has become obsolete as a result of RoHS directive on Jul 2006 that restricts the use of lead (Pb). Current methods for Tin Whisker mitigation strategy which uses Gold (Au) plated on a layer of Nickel with the based copper (Cu) conductor wire terminals of Flexible Flat Cable (FFC) is effective, but becoming uneconomical as gold price has increased over four folds over the past 10 years. Further, Tin-Whisker-controlled FFC still leave users with a small risk of those broken whiskers debris may cause short-circuit to other electronics circuitry within a printed circuit board.

These issues provide the impetus for our R&D team to perform research and development into other methods of achieving a completely WHISKERLESS FFC which is highly effective to mitigate tin-whisker existance, economical and yet environmentally friendly.

In collaboration with various research institutions, V8 Whiskerless FFC was developedd and tested by SGS (better than INEMI Class 1 Standard) employing Tin-Alloy manufacturing process technology, which is Whisker FREE, cost-effective and environmentally friendly compared to conventional gold-plating method.


  • Reduction of COST to replace the use of Gold (Au) Plating FFC contact terminals by more than 30%
  • Improve product delivery LEAD TIME (no gold plating process & time required)
  • Environmental Friendly (eliminate the use of chemical required by gold plating process)


  • Audio & Video Entertainment System
  • IoT-enabled devices
  • Sound-bar and Bluetooth Speakers
  • Game Consoles
  • Smartphone/Tablet & Laptop PC
  • Laser/Inkjet Printers/Scanner
  • Mobile Devices utilizing serial I/O technologies
  • Medical Devices & Others

Electron Microscope Picture

Ventura V-Flex® V8 FFC & Gold-Plated Connector Ventura V-Flex® V8 FFC & Tin-Plated Connector (Reflow)
No Whisker Growth observed after 1000 hours (tested by SGS) No Whisker Growth observed after 4000 hours (tested by SGS)

Automatic Production Lines

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